Fabrication of Multilayered Electrospun Nylon66 & Ag film for EMI Shielding and Enhanced Thermal Conductivity

Abstract

Recently, Electromagnetic interference (EMI) radiation problems have become serious as increasingly miniaturized, compact and high functionality of electronic devices. Due to the emitted electromagnetic radiation by electronic devices, EMI may affect the devices causing malfunction and harmful effect on human body. Although metals have widely used as a conventional EMI shielding material with high reflection of EMI shielding mechanisms, they have disadvantages such as heavy weight and inflexibility. Thus, there are many studies on polymers due to light weight and easy to make thin film, and on multilayered structures to increase absorption of electromagnetic wave through internal multiple reflection. But, polymers with low thermal conductivity have limitations on dissipation of heat generated by absorption of electromagnetic wave. In this research, multilayered films of silver deposited on electrospun nylon66 nanofibers using ebeam evaporator were fabricated to enhance both thermal conductivity and EMI shielding effectiveness. Enhancement of thermal conductivity, caused by an increase in the crystallinity of electrospun nylon66 nanofibers, was confirmed by laser flash and DSC(Differential scanning calorimeter). In addition, thermal conductivity and EMI shielding effectiveness of multilayered films were measured and analyzed using laser flash and network analyzer.