Process Optimization of Laser Micro Patterning

Abstract

This paper presents the processing depth, surface quality (Ra, Rz) and burr height prediction in pulse laser environment. Pulsed laser patterning is an indispensable element in laser patterning processes and is widely applied in current manufacturing technology. In addition, laser patterning equipment driven by laser frequency, power and scanning speed has many attractive features such as fast and precise patterning, relatively low spatial constraints, and low processing costs. Therefore, there is strong demand for predicting the machining result of the workpiece according to the main parameters of the pulse laser. In this paper, we study the processing depth(layer/depth), surface quality(Ra, Rz), burr height prediction and optimization in pulsed laser processing. Central Composite Design is used in the DOE method to predict the depth of cut, surface quality (Ra, Rz) and burr height. The frequency, power, and scanning speed of the pulse laser were selected as parameters, and a table for the number of 21 experiments was created and tested. HP4MA workpiece were used for the experiment, and a square of 6 by 0.5mm was laser patterned according to 21 experimental conditions. The effect of each parameter for the depth per layer, Ra, Rz, and bur height was analyzed using the ANOVA of the laser patterning process. Finally, predicted regression equations and prediction ranges for depth/layer, Ra, Rz, and burr height were obtained using the Central Composite Design.