Exploring Fingertip Slip Feedback for Haptic Augmentation and Referral Using Thermal Feedback
- Author(s)
- Kim, Donghyeon; Lim, Chungman; Park, Gunhyuk
- Type
- Conference Paper
- Citation
- 2025 IEEE World Haptics Conference, WHC 2025, pp.357 - 363
- Issued Date
- 2025-07-08
- Abstract
- Thermal feedback offers new possibilities for enhancing user experience by combining with vibrations. Yet, little research has explored haptic augmentation and referral through thermal feedback with texture slip feedback on the fingertip. To address this gap, we examined variations in tactile perception and the potential for the thermal referral phenomenon on the fingertip by integrating thermal and texture slip feedback. Using a custom haptic device, we delivered thermal stimuli ranging from 24 to 40°C alongside slip feedback related to three distinct textures (silk, felt, sandpaper) to the middle and distal phalanx of the fingertip, respectively. Participants assessed the perceived intensity, warmness, roughness, and stickiness of the integrated tactile feedback and identified the perceived location of the thermal sensation. Our results showed that thermal feedback can affect the roughness of intermediate texture (felt), increasing the median roughness rating from 43.5 to 60 on a 0-100 scale under cold and hot conditions, respectively. Furthermore, the occurrence rate of thermal referral increased as temperature increased (79.8% at a hot condition). We discuss the efficacy of thermal feedback in augmenting texture slip feedback and haptic referral and highlight implications for future research. © 2025 Elsevier B.V., All rights reserved.
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Conference Place
- KO
Suwon
- URI
- https://scholar.gist.ac.kr/handle/local/32277
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