OAK

Thermal protection of wearable devices under outdoor conditions using radiative cooling films

Metadata Downloads
Author(s)
Hyeon, ChanghwanJeong, MinseoKwon, SeokgyuBaek, JuhoonSeong, MyeongsuKim, MinkyungLee, Dasol
Type
Article
Citation
OPTICAL MATERIALS, v.167
Issued Date
2025-10
Abstract
Wearable electronic devices operating outdoors are vulnerable to overheating under prolonged exposure to intense solar radiation and elevated ambient temperatures. Such thermal stress compromises device performance, inducing functional failure, and poses safety risks such as skin burns. Therefore, we developed a passive radiative cooling film (RCF) providing energy-free thermal management for wearable electronics. The RCF, fabricated via electrospinning of a polyvinyl alcohol matrix embedded with silicon dioxide (SiO2) and aluminum oxide (Al2O3) nanoparticles, exhibits optimized optical properties, including a high average solar reflectance of 0.88 (0.3-2.5 mu m) and thermal emissivity of 0.95 in the atmospheric window (8-13 mu m). These properties enable effective radiative heat dissipation and reduce the solar heat gain. Under high-temperature outdoor conditions, RCF-integrated wearable sensors maintained an average surface temperature of 42.5 degrees C, which was up to 8.6 degrees C lower than that of sensors without the film, ensuring stable operation without thermal failure. Additionally, the RCF effectively mitigated thermal accumulation in smartphone batteries, reducing peak surface temperature from 60.0 degrees C to 37.1 degrees C under direct sunlight. These results demonstrate the potential of the RCF as a scalable and energy-efficient solution for enhancing thermal reliability and user safety of next-generation wearable outdoor electronic devices.
Publisher
ELSEVIER
ISSN
0925-3467
DOI
10.1016/j.optmat.2025.117258
URI
https://scholar.gist.ac.kr/handle/local/31560
공개 및 라이선스
  • 공개 구분공개
파일 목록
  • 관련 파일이 존재하지 않습니다.

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.