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Synthesis of Chemically Stable Ultrathin SiO2-Coated Core-Shell Perovskite QDs via Modulation of Ligand Binding Energy for All-Solution-Processed Light-Emitting Diodes

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Abstract
Recently, perovskite quantum dots (QDs) have attracted intensive interest due to their outstanding optical properties, but their extremely poor chemical stability hinders the development of the high-performance perovskite QD-based light-emitting diodes (PeLEDs). In this study, chemically stable SiO2-coated core-shell perovskite QDs are prepared to fabricate all-solution-processed PeLEDs. When the SiO2 shell thickness increases, the chemical stability of perovskite QDs is dramatically improved, while the charge injection efficiency is significantly decreased, which becomes the biggest obstacle for PeLED applications. Thus, controlling the SiO2 thickness is essential to obtain core-shell perovskite QDs optimal for PeLEDs in an aspect of chemical and optoelectrical properties. The 3-aminopropyl-triethoxysilane (APTES)/oleylamine (OAm) volume ratio is found to be a critical factor for obtaining an ultrathin SiO2 shell. Optimization of the APTES/OAm ratio affords A-site-doped CsPbBr3 QDs with an ultrathin SiO2 shell (A-CsPbBr3@SiO2 QDs) that exhibit longer radiative lifetimes and smaller shallow trap fraction than those without A-site doping, resulting in a higher photoluminescence quantum yield. A-CsPbBr3@SiO2 QDs also demonstrate long-term superior chemical stability in polar solvents without loss of optical properties due to passivation by the SiO2 shell and less defects via A-site doping. Consequently, all-solution-processed PeLED is successfully fabricated under ambient conditions, facilitating perovskite QD utilization in low-cost, large-area, flexible next-generation displays.
Author(s)
Trinh, Cuc KimLee, HanleemSo, Mo GeunLee, Chang-Lyoul
Issued Date
2021-06
Type
Article
DOI
10.1021/acsami.1c06097
URI
https://scholar.gist.ac.kr/handle/local/11454
Publisher
American Chemical Society
Citation
ACS Applied Materials and Interfaces, v.13, no.25, pp.29798 - 29808
ISSN
1944-8244
Appears in Collections:
ETC > 1. Journal Articles
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