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GIST Scholar College of Artificial Intelligence Department of Electrical Engineering and Computer Science 2. Conference Papers

A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit

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Author(s)
Samanta, Anirban; Chang, Po-Hsuan; Yan, Peng; Fu, Mingye; Berkay-On, Mehmet; Kumar, Ankur; Kang, Hyungryul; Yi, Il-Min; Annabattuni, Dedeepya; Zhang, Yu; Scott, David; Patti, Robert; Fan, Yang-Hang; Zhu, Yuanming; Palermo, Samuel; Ben Yoo, S.J.
Type
Conference Paper
Citation
2023 Optical Fiber Communications Conference and Exhibition, OFC 2023
Issued Date
2023-05-05
Abstract
We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI®) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency. © 2023 The Author(s).
Publisher
Institute of Electrical and Electronics Engineers Inc.
Conference Place
US
San Diego
URI
https://scholar.gist.ac.kr/handle/local/34163
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