A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit

Abstract

We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI®) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency. © 2023 The Author(s).