A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET

Abstract

This paper presents an energy-efficient electronic-photonic co-designed transceiver heterogeneously 3D-integrated with high-density, low-parasitic direct bond interconnect (DBI®) featuring 32-channel silicon photonic microdisk modulator/filter based optical transceivers in 12nm FinFET for wavelength division multiplexing (WDM). The transmitter has 1.2Vppd electrical modulation swing and 7dB extinction ratio. The receiver achieves an OMA sensitivity of -18.82dBm at 18Gb/s. The transceiver pair at 18Gb/s achieves 496fJ/bit energy efficiency. The receiver can further operate at 25Gb/s with -16.9dBm OMA and 227fJ/bit efficiency. © 2023 JSAP.