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GIST Repository College of Information and Computing Department of Electrical Engineering and Computer Science 2. Conference Papers

Adhesive wafer bonding of GaN, InP and Si with passivated GaAs substrate by selective SeS2 treatment and its dielectric properties

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Author(s)
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Type
Conference Paper
Issued Date
2005-10-01
URI
https://scholar.gist.ac.kr/handle/local/27901
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