OAK

Analysis of the temperature effect on the liquid bridge behavior between fixed plates for the heat switch system

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Author(s)
이선규
Issued Date
2013-04-10
Type
Conference Paper
URI
https://scholar.gist.ac.kr/handle/local/23351
Publisher
ICEP
Citation
ICEP 2013
Conference Place
JA
Appears in Collections:
Department of Mechanical and Robotics Engineering > 2. Conference Papers
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