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GIST Repository College of Information and Computing Department of Electrical Engineering and Computer Science 2. Conference Papers

High density optical packaging of high radix silicon photonic switches

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Abstract
We report on high density optical packaging of high radix (64x64) silicon photonic MEMS switches using pitch-reducing optical fiber array. The footprint of 61-channel optical I/O is as small as 330μm x 280μm.
Author(s)
SEOK, TAE JOON; Kopp, Victor; Neugroschl, Dan; Henriksson, Johannes; Luo, Jianheng; Wu, Ming C.
Issued Date
2017-03
Type
Conference Paper
DOI
10.1364/OFC.2017.Th5D.7
URI
https://scholar.gist.ac.kr/handle/local/20406
Publisher
OSA - The Optical Society
Citation
Optical Fiber Communication Conference, OFC 2017
Conference Place
US
Appears in Collections:
Department of Electrical Engineering and Computer Science > 2. Conference Papers
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